Matrix Electronics Unveils Next Generation Highly Engineered PCB and IC Substrate Manufacturing Automation Equipment

Matrix Electronics and Advanced Engineering (AE) are pleased to announce the launch of a new generation of automated robotic handling and peeler systems for the printed circuit board and integrated circuit board manufacturing industry.

Advanced Engineering continues to impress the PCB industry with its ingenious PCB and current IC board automation solutions. The AE engineering team offers complete automation equipment and software solutions from its specialist shop in Hallein, Austria, focused on accelerating customer production with consistency and accuracy.

“We are impressed that North American PCB manufacturers are adopting and enhancing automation in their factories. The PCB industry is strong in North America and Matrix is ​​looking for innovative ways to support customer growth.” ,” said Kieran Healy, President of Matrix Electronics. “Advanced Engineering’s new equipment designs, including MOJO, Servant and Peeler devices, take our customer’s PCB manufacturing to the next level. This highly automated approach to PCB manufacturing optimizes factory capacity while , reduce costs and ensure consistency and quality.”

Advanced Engineering utilizes the latest software and component technology from well-known manufacturers such as BECKHOFF, SICK, KEYENCE, PILZ and FESTO. All machines are directly linked to his MES or ERP system allowing the customer excellent data collection and reporting. Information gathered from these systems is fed back to process engineering to optimize line productivity and efficiency.

“Advanced Engineering is focused on innovation through new approaches to PCB and IC substrate manufacturing automation. We worked from the ground up to reimagine, redefine, and reinvent equipment delivery.” The result is an innovative, clean, fast, and robust Industry 4.0 compliant PCB automation manufacturing solution. ”

A state-of-the-art touch panel interface with reduced power consumption, HEPA filtering and easily customizable “line controller” software are key integrations in the highly engineered line-up. Several Laser Direct Imaging (LDI), Automated Optical Inspection (AOI), InkJet, Loader and Unloader, Buffer Systems, Development Etch, Strip (DES) and Strip, Etch, Strip (SES) lines directly linked to line controllers can. Simplify complex processes while bridging the gap between automated machines and manufacturing execution systems (MES).

For more information, see: www.matrixelectronics.com.